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DYYRENT Micro-Cutting Blades | Precision Sub-Millimeter Tools for Semiconductor & Medical Device Manufacturing
Micro Blade
- ✅ Core Material: Ultra-Grain WC-Co Cemented Carbide
- ✅ Hardness: 2200HV (Vickers Scale)
- ✅ Coating: 3μm AlCrN + DLC Multilayer
- ✅ Precision: ±0.005mm Profile Tolerance
- ✅ Edge Geometry: 0.1-0.3mm Cutting Width
- ✅ Surface Finish: Ra 0.02μm Mirror Polish
- ✅ Certifications: ISO 9001, ISO 13485
- ✅ Applications: Micro-EDM, Biomedical Stent Cutting
- MOQ : 0 units
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- In Stock : 0 units
Nano-Scale Manufacturing Technology
Advanced Composite Architecture
- Base Material:
- 94% Tungsten Carbide (0.5μm grain size)
- 6% Cobalt Binder Phase
- Surface Engineering:
- PVD AlCrN Base Layer (3μm)
- CVD Diamond-Like Carbon (1.5μm)
- Ion Beam Smoothing Treatment
- Key Parameters:
- Fracture Toughness: 12MPa·m¹/²
- Thermal Stability: 800°C Continuous
Micro-Machining Performance Benchmark
| Performance Metric | Standard Blades | DYYRENT Micro Blades | Improvement |
|---|---|---|---|
| PCB Trace Cutting Lifespan | 5,000 linear meters | 22,000 linear meters | +340% |
| Medical Stent Kerf Width | 0.08-0.12mm | 0.03-0.05mm | -63% |
| Silicon Wafer Breakage Rate | 8-12% | 0.5-1.2% | -91% |
Precision Engineering Applications
Semiconductor Packaging
- ▶ 01005 Component Singulation
- ▶ 20μm Ultra-Fine Pitch Capability
- ▶ 99.95% Cut Edge Quality
Orthopedic Implant Machining
- ▶ Titanium Alloy Bone Screw Threading
- ▶ 50nm Surface Finish Requirement
- ▶ 100% Deburring Guarantee
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