Precision Cutting Blades for Electronics & Micro-Manufacturing | DYYRENT Industrial Solutions
Key Electronics & Precision Applications
DYYRENT blades enable flawless processing for mission-critical micro-components:
✓ PCB Depaneling – Clean FR4 and flexible circuit board separation ✓ Semiconductor Wafer Dicing – Sub-20μm kerf for silicon/glass substrates ✓ EMI Shielding Cutting – Precision slitting of conductive foils and films ✓ Micro-Sensor Trimming – Burr-free edges on MEMS and optical components ✓ Display Panel Processing – OLED/LCD film lamination and edge finishing
Why Global Tech Leaders Rely on DYYRENT?
► ±2μm Tolerance – Diamond-coated edges for nano-scale precision ► 60% Longer Edge Life – Nano-ceramic treatment resists micro-chipping ► 0.02mm Thin-Blade Tech – Process ultra-fine flex circuits without warping ► Anti-Static Certification – Eliminate ESD risks in cleanroom environments ► IoT Performance Tracking – Predictive maintenance via edge wear algorithms
Trusted by Innovators in: 5G Components, Medical Micro-Devices, Robotics & 15+ High-Tech Sectors
